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Please use this identifier to cite or link to this item: http://localhost:8080/xmlui/handle/123456789/1829
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dc.contributor.authorChugh, Nisha-
dc.date.accessioned2025-03-26T07:20:21Z-
dc.date.available2025-03-26T07:20:21Z-
dc.date.issued2024-
dc.identifier.issn2773-0123-
dc.identifier.urihttps://www.sciencedirect.com/science/article/abs/pii/S2773012324003054-
dc.identifier.urihttp://localhost:8080/xmlui/handle/123456789/1829-
dc.description.abstractTunnel-FETs are ideal for low-power electronic applications, particularly in areas requiring steep subthreshold slope and energy-efficient switching. However, traditional TFETs face major issues, including low ON-current ( ), random dopant fluctuations, and ambipolar conduction, which limit their performance and scalability. To address these issues, this study proposes the novel design of a borophene-based vertical dopingless TFET, incorporating a gate–drain underlapping (GDU) technique. The study employs high- dielectrics, specifically , to improve electrostatic control within the device. Through extensive analysis and optimisation, the proposed device, featuring a 1nm dielectric, achieves a remarkable subthreshold swing of 8.44mV/dec and an impressive of 2.45 10-4 A/ m at a drain bias of 0.5V. The GDU technique effectively suppresses ambipolar conduction and reduces gate-to-drain capacitance, significantly improving device performance. By leveraging borophene’s unique properties and the novel vertical dopingless architecture, this work advances the design of TFETs.en_US
dc.language.isoenen_US
dc.publisherMicro and Nanostructuresen_US
dc.titleBorophene vertical dopingless Tunnel FET with high-κ dielectric and incorporating gate-drain underlapping techniqueen_US
Appears in Collections:VSE&T

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